A Study on the design and fabrication of Pluggable Lens for Optical PCB Interconnection

由 ty10086 提交于 周四, 08/26/2021 - 12:51
文章英文标题
A Study on the design and fabrication of Pluggable Lens for Optical PCB Interconnection
正文
A Study on the design and fabrication of Pluggable Lens for Optical PCB InterconnectionOptical PCB;Optical interconnection;pluggable lens;reflow process;Passive alignment;In this study, an optical PCB was proposed which can overcome the limitations of the conventional PCB, and a new structure with pluggable lens was considered for a high-efficient passive alignment. The structure was a lens-added optical waveguide for the improvement of misalignment between the lens and the waveguide in the alignment. Also, as it had a barrier-type structure to prevent the surface damage of the lens by desorption, the high-efficient passive alignment can be realized. The structure was designed by optimizing the simulation and the fabrication process of the pluggable lens structure was conducted using the repetitive photolithography and the thermal reflow. The optical waveguide with the lens-integrated pluggable interconnection was fabricated by the imprint process using the polydimethylsiloxane(PDMS) replica mold. Therefore, we confirmed the possibility of pluggable lens-added optical waveguide structure fabrication for high-efficient passive alignment.
文章内容（英文）
A Study on the design and fabrication of Pluggable Lens for Optical PCB InterconnectionOptical PCB;Optical interconnection;pluggable lens;reflow process;Passive alignment;In this study, an optical PCB was proposed which can overcome the limitations of the conventional PCB, and a new structure with pluggable lens was considered for a high-efficient passive alignment. The structure was a lens-added optical waveguide for the improvement of misalignment between the lens and the waveguide in the alignment. Also, as it had a barrier-type structure to prevent the surface damage of the lens by desorption, the high-efficient passive alignment can be realized. The structure was designed by optimizing the simulation and the fabrication process of the pluggable lens structure was conducted using the repetitive photolithography and the thermal reflow. The optical waveguide with the lens-integrated pluggable interconnection was fabricated by the imprint process using the polydimethylsiloxane(PDMS) replica mold. Therefore, we confirmed the possibility of pluggable lens-added optical waveguide structure fabrication for high-efficient passive alignment.
来源出处
Journal|[J]Journal of the Microelectronics and Packaging SocietyVolume 21, Issue 1. 2014. PP 25-29

标签

PDMS臻品推荐

PDMS-微流控基质材料-PDMS/道康宁SYLGARD184-聚二甲基硅氧烷/0.5KG(组)

产品说明书PDF自助在线看：http://www.pdmshub.com/sih

信息更新：

美国总工厂生产的0.5KG原始包装的PDMS延期至2021年9月16日后才能交货，默认我们将发国内库存的进口分装产品（02085925-0.5KG）；另受制于有机硅大幅涨价潮影响，2021年9月1日后将上调销售价格，另行通知。Dow Corning=道康宁=Dow SiL=陶氏，都是同一家公司。 2021.09.01更新

美国总工厂生产的0.5KG包装的PDMS恢复正常进口，合法正规，质量金标准，欢迎订购使用。并承诺从我司购买的皆为原厂包装,100%未开封,附带技术手册,非国产灌装仿制、非分装、非仿冒外包装产品,可以放心使用。大量订购更有优惠。2021.04.01更新

备注：由于dowsil与道康宁公司合并，美国总工厂生产的PDMS，价格涨幅高达1倍之多，因针对科研用户使用，特备货规格0.5KG。如果您需要美国总工厂原厂生产的大规格包装的预定，可以与QQ 11366508联系给予报价/货期。2021.05更新

此链接为PDMS-微流控芯片/PDMS/道康宁SYLGARD184/小桶0.5KG装的链接。

一般性的产品性能参数表参考以下小桶装的参数：

微流控芯片/PDMS/道康宁SYLGARD184；微流控芯片/PDMS/道康宁SYLGARD184；微流控芯片/PDMS/道康宁SYLGARD184；

品牌型号：道康宁SYLGARD184

包装规格：0.5KG/罐[含有45.4g固化剂，总重量为0.5KG]

产品颜色：保质期限：36个月

存放环境说明：室温,阴凉处保存

备注说明：

美国道康宁道康宁SYLGARD 184硅橡胶是由液体组分组成的双组分套件产品，包括基本组分与固化剂。基本组分与固化剂按10:1重量比完全混合，中等粘度混合液的稠度与SAE 40机油相似。无论厚薄，混合液将固化成为具有韧性的透明弹性体，最适用于电子／电气方面的封装与灌封应用。 道康宁SYLGARD 184硅橡胶在25~150℃的温度范围内固化，无放热现象，无需二次固化。固化过程完成后，可立即在-55~200℃的温度范围内使用。 产品特性：低毒性，在常规的工业操作中，无特别的注意事项； 无溶剂或固化副产物， 固化时不放热；无需特殊的通风条件，不会产生腐蚀；固化时，收缩量小； 固化后， 透明具有弹性；抗震与减缓机械震动；振动的传递性能小；元件可裸视检查与易修补性； 环保性能；低吸水性，良好的耐辐射性能；高真空状态下的低漏气性； 优异的电性能；较大温度范围内的稳定性， 抗解聚；在-55~200℃范围内，甚至在密闭状态下保持弹性与柔韧性，性能稳定； 阻燃性，UL可燃性分级为94 V-1，温度等级：130℃ 产品用途： 道康宁SYLGARD 184硅橡胶在电气／电子的封装与灌封方面有广泛的应用。